TSMCs Version of EMIB is LSI: Currently in Pre-Qualification
Whilst process node technologies and Moore’s Law are slowing down, manufacturers and chip designers are looking to new creative solutions to further enable device and performance scaling. Advanced packaging technologies are one such area where we’ve seen tremendous innovations over the past few years, such as the introduction of silicon interposers and integration of HBM-memory or the shift towards modularisation through chiplet designs.
Silicon interposers pose cost challenges as they are expensive and require quite a large silicon footprint, whilst chiplet designs which use conventional packaging on organic substrates are limited by I/O bandwidth and power efficiency.
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